 |
| monitoring defects and contamination
in the bulk region of Si wafer |
 |
impurities due to heavy metal contamination
|
|
can detect Co,Ni,Ti,Mo,W,Pt,Au,Pd
can detect but not identify them
uniquely |
|
can detect & identify Cu and Cr
|
|
iron concentration determination both in CZ &
FZ wafers
|
|
requires surface passivation : thermal oxide,
chemical passivation or corona charging
|
|
can be combined with the SPV,VQ and JPV
|
|
integrated FOUP and minienvironment
|
